Low Pressure Molding
Low Pressure Molding is a process used to encapsulate electronic components and to seal connectors. This process protects electronic components against moisture, dust, dirt and vibrations.
Applications:
- Waterproofing
- Impact & Vibration
- Strain Relief
Typical devices: Flash Drives, Circuit Boards with or without Batteries, LED Lighting, Automotive or Marine Electronics, Electronics Exposed to Moisture
Industries:
- Auto
- Marine
- Industrial
- Medical
- Technology
- Environmental
- Military
- Consumer
We work with TECHNOMELT adhesives developed by Henkel AG & Company.
TECHNOMELT Benefits
- Easy Moldability
- Good adhesion to a variety of substrates
- Excellent moisture resistance
- Excellent environmental resistance
| TECHNOMELT PA 638 Characteristics | |
|---|---|
| Chemistry | Polyamide |
| Appearance | Black |
| Flammability Rating | UL 94 V0 |
| Operating Temperature | -40 to + 125 °C |
| Shore Hardness | 90 Shore A |
| Elongation at break (%) | 400 |
| Dielectric Constant/Dissipation Factor, IEC 60250 | 1 MHz @ 3.6/0.076 1 GHz @ 2.7/0.023 1.8 GHz @ 2.9/0.042 |
| Dielectric Strength (kV/mm) | 19 |
| Volume Resistivity (Ohms-cm) | 2.4x10(EXP13) |
| Surface Insulation Resistance (SIR) Testing - IPC-TM-650 | Pass |