Low Pressure Molding

Low Pressure Molding is a process used to encapsulate electronic components and to seal connectors. This process protects electronic components against moisture, dust, dirt and vibrations.


  • Waterproofing
  • Impact & Vibration
  • Strain Relief

Typical devices: Flash Drives, Circuit Boards with or without Batteries, LED Lighting, Automotive or Marine Electronics, Electronics Exposed to Moisture



  • Auto
  • Marine
  • Industrial
  • Medical
  • Technology
  • Environmental
  • Military
  • Consumer

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We work with TECHNOMELT adhesives developed by Henkel AG & Company.


  • Easy Moldability
  • Good adhesion to a variety of substrates
  • Excellent moisture resistance
  • Excellent environmental resistance


TECHNOMELT PA 638 Characteristics
Flammability RatingUL 94 V0
Operating Temperature-40 to + 125 °C
Shore Hardness90 Shore A
Elongation at break (%)400
Dielectric Constant/Dissipation Factor, IEC 602501 MHz @ 3.6/0.076
1 GHz @ 2.7/0.023
1.8 GHz @ 2.9/0.042
Dielectric Strength (kV/mm)19
Volume Resistivity (Ohms-cm)2.4x10(EXP13)
Surface Insulation Resistance (SIR) Testing - IPC-TM-650Pass