Low Pressure Molding is a process used to encapsulate electronic components and to seal connectors. This process protects electronic components against moisture, dust, dirt and vibrations.

Applications:

• Waterproofing
• Impact & Vibration
• Strain Relief

Typical devices: Flash Drives, Circuit Boards with or without Batteries, LED Lighting, Automotive or Marine Electronics, Electronics Exposed to Moisture

Industries:

• Auto
• Marine
• Industrial
• Medical
• Technology
• Environmental
• Military
• Consumer

We work with TECHNOMELT adhesives developed by Henkel AG & Company.

TECHNOMELT Benefits

• Easy Moldability
• Good adhesion to a variety of substrates
• Excellent moisture resistance
• Excellent environmental resistance